Hi All,
Hope everyone is having a fab Mar10 day.
I have a couple of Gummy O-ring mount builds that I have been slowly working on for a bit and am finally getting to the final stages and I’ve noticed two issues that I’m wondering if anyone else had been able to work through:
- I’m using a Tsangan bottom row and, with the switches being shifted inward (toward the space bar), the O-ring doesn’t get pushed out toward the bottom corners. This has the effect of much of the O-ring NOT able to “interface” and cause friction with the case. I know this must be quite common because I see a lot of tsangan bottom row Unikorn’s, etc but I must be a bit of a problem on ANSI bottom rows as well since even those switches are inset a bit from the corner. Are there any “spacers” or another technique for keeping the o-ring more cornered?
- I am using a POM plate along with a solder Cyber60 PCB and I during soldering I typically compress the board and PCB pretty significantly to apply compression to the foam in between them. I believe this has caused a bit of warping on the PCB (and plate). I’m typically using some sort of gasket, etc mounting which will force that warp to regulate by keeping pressure on all sides of the board but that’s not the case
with a gummy o-ring style build. Right now I’ve got it mostly cured just by lightly correcting the warpage but, short of using a metal or maybe CF plate are there any thoughts on ways to keep the board/plate assembly from warping?
Thanks for looking! I went into this with a few assumptions from older builds that didn’t apply. No deal-breakers or anything but I would like to make this build as perfect as possible.